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Catalog

IPC: from datasheet recommended footprint drawing

These parametric footprints take exact copper pad dimensions from recommended footprint drawing and improvise mask, paste, silk, asm, courtyard. Normally, as a first step, component body dimensions are improvised. This can be overridden by specifying BW and/or BL parameters (for Body Width and Body Length).

package
names
example bedrock-rnd footprint
(centerpad)centerpad-rfp
DFNdfn-rfp
EMT3 EMT3F ES6sot23-rfp
LQFPqfp-rfp
MLF (dual row)dfn-rfp
MLF (quad row)qfn-rfp
MO-178AA MO-178ABsot23-rfp
Mini6 S-Mini6sot23-rfp
PLCCplcc-rfp
QFNqfn-rfp
QFPqfp-rfp
SC70-* SC-107C SC59-6 SC59A SC74 SC74A SC75A SC88 SC88A SC89 SC90sot23-rfp
SM-8 SM6 SMT3 SMT5 SMT6sot23-rfp
SOIC with J leadssoj-rfp
SOICso-rfp
SOJsoj-rfp
SONso-rfp
SOPso-rfp
SOT23-* SOT323 SOT223-8 SOT353 SOT363 SOT416 SOT490 SOT553 SOT563 SOT25 SOT26 SOT346 SOT457 SOT523 SOT523F SOT553 SOT753sot23-rfp
SSOPso-rfp
TO236AA TO236ABsot23-rfp
TQFPqfp-rfp
TSOP-5 TSOP-6 TSSOP-5 TSSOP-6sot23-rfp
TSOPso-rfp
TSSOPso-rfp
UMT3 UMT5 UMT6 US6sot23-rfp
two terminal rectangular passive (1206, 0805, 0603, etc)pas2-rfp