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Path in catalog: catalog / footprints / datasheet-RFP
These parametric footprints take exact copper pad dimensions from recommended footprint drawing and improvise mask, paste, silk, asm, courtyard. Normally, as a first step, component body dimensions are improvised. This can be overridden by specifying BW and/or BL parameters (for Body Width and Body Length). |
package names | example | bedrock-rnd footprint |
---|---|---|
(centerpad) | centerpad-rfp | |
DFN | dfn-rfp | |
EMT3 EMT3F ES6 | sot23-rfp | |
LQFP | qfp-rfp | |
MLF (dual row) | dfn-rfp | |
MLF (quad row) | qfn-rfp | |
MO-178AA MO-178AB | sot23-rfp | |
Mini6 S-Mini6 | sot23-rfp | |
PLCC | plcc-rfp | |
QFN | qfn-rfp | |
QFP | qfp-rfp | |
SC70-* SC-107C SC59-6 SC59A SC74 SC74A SC75A SC88 SC88A SC89 SC90 | sot23-rfp | |
SM-8 SM6 SMT3 SMT5 SMT6 | sot23-rfp | |
SOIC with J leads | soj-rfp | |
SOIC | so-rfp | |
SOJ | soj-rfp | |
SON | so-rfp | |
SOP | so-rfp | |
SOT23-* SOT323 SOT223-8 SOT353 SOT363 SOT416 SOT490 SOT553 SOT563 SOT25 SOT26 SOT346 SOT457 SOT523 SOT523F SOT553 SOT753 | sot23-rfp | |
SSOP | so-rfp | |
TO236AA TO236AB | sot23-rfp | |
TQFP | qfp-rfp | |
TSOP-5 TSOP-6 TSSOP-5 TSSOP-6 | sot23-rfp | |
TSOP | so-rfp | |
TSSOP | so-rfp | |
UMT3 UMT5 UMT6 US6 | sot23-rfp | |
two terminal rectangular passive (1206, 0805, 0603, etc) | pas2-rfp |