A.2. Standards, resources, links

Below is a collection of external documents covering the topic of footprint design.

A.2.1. Standards

• IPC7351 - Generic Requirements for Surface Mount Design and Land Pattern Standard
• IPC7525a - Stencil Design Guidelines
• IPC/EIA J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies
• IPC-SM-782 - Surface Mount Design and Land Pattern Standard (much older than IPC7351 but has per footprint class recommended dimensions)
• IPC753x with package dimension tables (Russian): IEC-61188-5-2 IEC-61188-5-3 IEC-61188-5-4 IEC-61188-5-5 IEC-61188-5-6 IEC-61188-5-8
• IPC-CM-770E - Guidelines for Printed Board Component Mounting (for thru-hole considerations)
• IPC2221A - Generic Standard on Printed Board Design (for thru-hole considerations in section 8.3. and 9.); older revision
• IPC2222 - Sectional Design Standard for Rigid Organic Printed Boards (for thru-hole considerations)

A.2.2. Resources

• lihata file format specification:
  • pcb-rnd data model
  • format low level: syntax
  • format high level
• tEDAx file format specification

A.2.3. External links

• Principles of land pattern design - presentation on IPC7351
• Mentor Graphics' app note on package names and zero orientation for each (based on IPC7351b) ; same from IPC/IEC
• List of IPC-compliant package names (syntax)
• Sodler paste and stencil
  • PCBWay's analysis on tombstoning
  • TechSparks Comprehensive Guide to PCB Stencils
  • stencil design basics (paste layer) with dimensions for common SMD parts
  • detailed analysis on tombstoning
  • TI application note on QFN footprints
  • Infineon application note on PG-LQFP
  • Solder paste print inspection and defect guide by Bob Willis - helps understanding how stencil printing works in practice

A.2.4. Other footprint design guides

• Sierra Circuits proto express (SMD, Thru-hole, all in inches)