Combined Glossary Table
term | description | facets
| 5/5 | 5mil minimum traces & 5mil minimum spacing |
6/5 | 6mil minimum traces & 5mil minimum spacing |
AMC | aluminum metal core |
ACY |
additive |
Adhesive |
Altium |
Annular Ring |
Annulus |
AOI automatic optical inspection |
Aperture |
Arc |
Array |
assembly |
AutoCAD |
autorouter |
Autotrax |
Autotrax |
AXI automated x-ray inspection |
Axial |
Bakelite |
BGA |
Blind Via |
bloat |
board house |
Board Thickness |
Breadboard |
buffer |
Buried Via |
bus |
C4 Controlled collapse chip connection |
CAD |
CAM files |
CAM |
Capture |
Card Edge connector |
Castellations |
CEM-1 |
CEM-3 |
Centroid |
centroid |
Chip Scale Package |
clad |
Clearance |
Coating (Spin, Roll, Film) |
COB |
Component Side |
Component |
Computer Aided Design |
Computer Aided Machining |
Conformal Coating |
Conformal coating |
connect |
Copper Foil |
Copper weight |
Copper |
copper |
courtyard |
cte coefficient of thermal expansion (see tce) |
Curve, open |
delamination |
DFSM Dry film soldermask |
Dialectric |
Diameter |
Dielectric |
differential pair |
DIP |
Discrete Component |
double-sided |
DRC design rule check |
Drill file |
Eagle |
EDF |
EDI Electronic Data Interchange |
Endpoint |
ENIG Electroless Nickel Immersion Gold |
epoxy resin |
ESD Electrostatic Discharge |
Etching |
Excellon |
explicit layer |
fabrication fab |
Feedthrough Via |
fidocad |
Fiducial |
Finger |
Finite Element Filter |
Fixture |
flags |
Flex |
Flip chip |
flood fill |
Flux |
Flying probe |
Foil |
font |
Footprint |
FR-1 |
FR-2 |
FR-3 |
FR-4 |
Gcode |
gEDA |
Gerber |
grid snap |
grid-pitch |
grid |
Hard Gold pcb surface finish (slip rings, fingers, etc) |
HASL Hot Air surface levelling |
High Density Interconnect(HDI) |
Hole |
Immersion Silver |
Immersion Tin |
implicit layer |
Integrated Circuit |
IPC (circa 1957) |
JIT |
Kapton |
KiCAD |
Knife |
Laminate |
Land |
Laser |
Layer Group |
Layer Sequence |
Layers (Physical) |
Layers (Virtual) |
Library |
Lihata |
mask |
Masonite |
Mentor |
Mil |
Milling |
milling |
Mirroring |
Mouse bites |
Multilayer |
neckdown |
negative process |
Negative transfer |
NEMA |
Net |
Netlist |
ODB++ |
OrCAD |
OSP Organic Solderability preservative |
outline |
Package |
Pad |
padstack |
Panel Service |
panel |
Panelization |
paste stencil |
paste |
Path |
pcb-rnd |
PCB |
PDIP |
phenolic resin |
Photoengraving |
Photoresist |
pick and place pnp |
Pin |
pinout |
pitch |
PLCC plastic lead chip carrier |
plotter |
Polygon hole |
Polygon, complex |
Polygon, concave |
Polygon, convex |
Polygon, irregular |
Polygon, regular |
Polygon, simple |
Polygon |
polygon |
positive process |
Positive transfer |
Protel |
PTH |
Pyralux AP |
Pyralux FR |
Pyralux LF |
QFP |
Radial Lead |
Raster |
rat |
Ratsnest |
refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator |
reflow |
Registration |
resin |
resist |
RF |
Rigid-Flex |
Route and Retain |
routing style |
Routing |
routing |
RS-274D |
RS-274X |
Rubylithe |
Scoring |
Short |
Silk Screen |
Silk |
silk |
single-sided |
SIP |
slot |
SMD |
SMOBC soldermask over bare copper prevent unintended flow of tin/lead during reflow |
SMT |
Snap |
SOIC |
Solder Side |
Solder |
STEP |
Subcircuit |
Substrate |
Subtractive |
Symbol |
Tape out |
TCE thermal coefficient of expansion |
tEDAx |
Tented(Via) |
terminal |
TG Glass transition temp |
Thermal Via Thermal relief |
Thou |
Tin Whisker |
Tin |
TinyCAD |
Tolerance |
tombstone |
tooling |
toolpath generator |
toolpath |
toporouter |
Trace |
TT toner transfer |
V-Cut aka v-scoring |
V-score |
Vcc |
Vdd |
Vector |
Via stitching |
Via |
Wave Solder |
Wire bonding |
XY |