High: bad assumptions: layers

  • layer vs. object type
    • element-line again...
    • minimize layers, use different types (gEDA/PCB footprints)
    • minimize types, express purpose by layer (pcb-rnd)
    • even worse: mixtures (PADS ASCII)
    • cases:
      • copper
      • silk
      • mask, paste, adhesive
      • outline, cutouts
      • documentation layers (fab, assy)
    • layer pro: layer is data, easier to extend
  • fixed layer setup vs. anything goes
    • "16 copper layers should be enough" -> integer layer IDs
    • "silk/mask/paste never intern" (rigid-flex boards!)
    • "imply substrate" -> thickness, simulation


Source: pcbunlimited.com

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