| ID: | 920 |
| From: | Alain Vigne <al...@gmail.com> |
| Date: | Sun, 1 Oct 2017 22:15:25 +0200 |
| Subject: | Re: [pcb-rnd] The Big Data Model Cleanup - midpoint summary |
| in-reply-to: | 919 from ge...@igor2.repo.hu |
| replies: | 921 from John Griessen <jo...@cibolo.com> |
--94eb2c048e7c2e420c055a81ebfc Content-Type: text/plain; charset="UTF-8" Congratulations Igor2, for architecture of such a huge piece of software ... I admire your pugnacity and resilience. Keep up the good work. Best regards Alain On Sun, Oct 1, 2017 at 6:50 PM, <gedau@igor2.repo.hu> wrote: > Hi all, > > all the work with the layer rewrite, subcircuits and terminals are not > just random features. These are all parts of a bigger plan, an idea that > has been floating on the geda-user mailing list for many years: a data > model cleanup. > > This idea had many manifestations from requests of footprint features that > could not be fulfilled because of the limited data model to support of > hierarchical netlists. Seemingly unrelated, random features that in turn > lead to the fundamental limitations of the old data model. > > After about a year of work, I decided to draw a full roadmap of the effort: > > http://repo.hu/projects/pcb-rnd/developer/new_model_progress/roadmap.svg > > Green items are done, red items will be done during the next months. > > By the number of items we are about halfway through the plan, but the > first few items (new native file format, layer rewrite, layer compositing > and subcircuits) needed much more work than some of the later items will. > I'd say by the amount of work we are about 70..75% done. > > What we'd have at the end: > > - a layer model that supports compositing and can capture reality more > closely (already done) > > - unlimited footprints by subcircuits (already done) > > - unlimited pad shapes (already done, with subcircuit "heavy model") > > - pad stacks: much less limited vias/pins/light-model-pads with bbvia > > - a much simpler, more orthogonal, easier to understand and extend data > model > > - more precise import/export from/to other EDA systems as our model will > support most features other EDA systems do > > - a lot of element-related special-case code removal -> smaller, cleaner > code > > > Regards, > > Igor2 > > > > -- Alain V. --94eb2c048e7c2e420c055a81ebfc Content-Type: text/html; charset="UTF-8" Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr"><div><div><div><div>Congratulations Igor2, for architectur= e of such a huge piece of software ...<br><br></div>I admire your pugnacity= and resilience.<br></div>Keep up the good work.<br><br></div>Best regards<= br></div>Alain<br></div><div class=3D"gmail_extra"><br><div class=3D"gmail_= quote">On Sun, Oct 1, 2017 at 6:50 PM, <span dir=3D"ltr"><<a href=3D"ma= ilto:gedau@igor2.repo.hu" target=3D"_blank">gedau@igor2.repo.hu</a>></sp= an> wrote:<br><blockquote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;= border-left:1px #ccc solid;padding-left:1ex"><div class=3D"HOEnZb"><div cla= ss=3D"h5">Hi all,<br> <br> all the work with the layer rewrite, subcircuits and terminals are not just= random features. These are all parts of a bigger plan, an idea that has be= en floating on the geda-user mailing list for many years: a data model clea= nup.<br> <br> This idea had many manifestations from requests of footprint features that = could not be fulfilled because of the limited data model to support of hier= archical netlists. Seemingly unrelated, random features that in turn lead t= o the fundamental limitations of the old data model.<br> <br> After about a year of work, I decided to draw a full roadmap of the effort:= <br> <br> <a href=3D"http://repo.hu/projects/pcb-rnd/developer/new_model_progress/roa= dmap.svg" rel=3D"noreferrer" target=3D"_blank">http://repo.hu/projects/pcb-= rn<wbr>d/developer/new_model_progress<wbr>/roadmap.svg</a><br> <br> Green items are done, red items will be done during the next months.<br> <br> By the number of items we are about halfway through the plan, but the first= few items (new native file format, layer rewrite, layer compositing and su= bcircuits) needed much more work than some of the later items will. I'd= say by the amount of work we are about 70..75% done.<br> <br> What we'd have at the end:<br> <br> - a layer model that supports compositing and can capture reality more clos= ely (already done)<br> <br> - unlimited footprints by subcircuits (already done)<br> <br> - unlimited pad shapes (already done, with subcircuit "heavy model&quo= t;)<br> <br> - pad stacks: much less limited vias/pins/light-model-pads with bbvia<br> <br> - a much simpler, more orthogonal, easier to understand and extend data mod= el<br> <br> - more precise import/export from/to other EDA systems as our model will su= pport most features other EDA systems do<br> <br> - a lot of element-related special-case code removal -> smaller, cleaner= code<br> <br> <br> Regards,<br> <br> Igor2<br> <br> <br> <br> </div></div></blockquote></div><br><br clear=3D"all"><br>-- <br><div class= =3D"gmail_signature" data-smartmail=3D"gmail_signature">Alain V.</div> </div> --94eb2c048e7c2e420c055a81ebfc--
Reply subtree:
920 Re: [pcb-rnd] The Big Data Model Cleanup - midpoint summary from Alain Vigne <al...@gmail.com>
921 [pcb-rnd] A usability request -- triggered by such frequent need to start new from John Griessen <jo...@cibolo.com>
922 Re: [pcb-rnd] A usability request -- triggered by such frequent need from ge...@igor2.repo.hu
923 Re: [pcb-rnd] A usability request -- triggered by such frequent need from John Griessen <jo...@cibolo.com>