| ID: | 705 |
| From: | ge...@igor2.repo.hu |
| Date: | Tue, 30 May 2017 09:19:29 +0200 (CEST) |
| Subject: | Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model |
| in-reply-to: | 704 from miloh <fr...@gmail.com> |
This message is in MIME format. The first part should be readable text, while the remaining parts are likely unreadable without MIME-aware tools. --0-155735626-1496128769=:27212 Content-Type: TEXT/PLAIN; charset=UTF-8; format=flowed Content-Transfer-Encoding: QUOTED-PRINTABLE On Tue, 30 May 2017, miloh wrote: > > >On May 29, 2017 11:36 PM, <gedau@igor2.repo.hu> wrote: > > > On Mon, 29 May 2017, miloh wrote: > > > > On May 29, 2017 11:11 PM, <gedau@igor2.repo.hu> wrote: > =C2=A0 =C2=A0 =C2=A0Hi all, > >Will grouping of parts be available at some stage of the >subcircuit rebuild? > > >What do you mean? > > > >The way I was thinking of it, a grouping could be subcircuit that consists >of a set of footprints, which could be used for modules on chips, or >designing for shields/hats/capes. >=C2=A0 >I imagined grouping a set of footprints together and being able work with >them as a subcircuit, or breaking them apart, modifying the subcircuit, an= d >regrouping them. > This only needs subcircuit-in-subcircuit. I think we will support that=20 long term, but it probably won't work in early versions. The layer bindig= =20 is a bit tricky there. --0-155735626-1496128769=:27212--
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705 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model from ge...@igor2.repo.hu