| ID: | 704 |
| From: | miloh <fr...@gmail.com> |
| Date: | Tue, 30 May 2017 00:06:42 -0700 |
| Subject: | Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model redesign) |
| in-reply-to: | 703 from ge...@igor2.repo.hu |
| replies: | 705 from ge...@igor2.repo.hu |
--001a113e39588f63c40550b87489 Content-Type: text/plain; charset="UTF-8" On May 29, 2017 11:36 PM, <gedau@igor2.repo.hu> wrote: On Mon, 29 May 2017, miloh wrote: > > On May 29, 2017 11:11 PM, <gedau@igor2.repo.hu> wrote: > Hi all, > > Will grouping of parts be available at some stage of the subcircuit > rebuild? > What do you mean? The way I was thinking of it, a grouping could be subcircuit that consists of a set of footprints, which could be used for modules on chips, or designing for shields/hats/capes. I imagined grouping a set of footprints together and being able work with them as a subcircuit, or breaking them apart, modifying the subcircuit, and regrouping them. --001a113e39588f63c40550b87489 Content-Type: text/html; charset="UTF-8" Content-Transfer-Encoding: quoted-printable <div dir=3D"ltr"><div dir=3D"auto"><div><br><div class=3D"gmail_extra"><br>= <div class=3D"gmail_quote">On May 29, 2017 11:36 PM, <<a href=3D"mailto= :gedau@igor2.repo.hu" target=3D"_blank">gedau@igor2.repo.hu</a>> wrote:<= br type=3D"attribution"><blockquote class=3D"m_6229036229384798919quote" st= yle=3D"margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex"><div = class=3D"m_6229036229384798919quoted-text"><br> <br> On Mon, 29 May 2017, miloh wrote:<br> <br> </div><blockquote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;border-l= eft:1px #ccc solid;padding-left:1ex"><div class=3D"m_6229036229384798919quo= ted-text"> <br> <br> On May 29, 2017 11:11 PM, <<a href=3D"mailto:gedau@igor2.repo.hu" target= =3D"_blank">gedau@igor2.repo.hu</a>> wrote:<br> =C2=A0 =C2=A0 =C2=A0Hi all,<br> <br></div><div class=3D"m_6229036229384798919quoted-text"> Will grouping of parts be available at some stage of the subcircuit rebuild= ?<br> </div></blockquote> <br> What do you mean?<br> <br><br> </blockquote></div><br></div></div><div class=3D"gmail_extra">The way I was= thinking of it, a grouping could be subcircuit that consists of a set of f= ootprints, which could be used for modules on chips, or designing for shiel= ds/hats/capes.</div><div class=3D"gmail_extra">=C2=A0</div><div class=3D"gm= ail_extra" dir=3D"auto">I imagined grouping a set of footprints together an= d being able work with them as a subcircuit, or breaking them apart, modify= ing the subcircuit, and regrouping them.</div><div class=3D"gmail_extra" di= r=3D"auto"><br></div><div class=3D"gmail_extra" dir=3D"auto">=C2=A0</div></= div> </div> --001a113e39588f63c40550b87489--
Reply subtree:
704 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model redesign) from miloh <fr...@gmail.com>
705 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model from ge...@igor2.repo.hu