| ID: | 702 |
| From: | miloh <fr...@gmail.com> |
| Date: | Mon, 29 May 2017 23:34:02 -0700 |
| Subject: | Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model redesign) |
| in-reply-to: | 701 from ge...@igor2.repo.hu |
| replies: | 703 from ge...@igor2.repo.hu |
--001a113d77cc5b01000550b7fd99 Content-Type: text/plain; charset="UTF-8" On May 29, 2017 11:11 PM, <gedau@igor2.repo.hu> wrote: Hi all, <Snipped> Result: In practice this means our new footprints will be capable of hosting: - arbitrary shaped pads drawn as lines and polygons - arbitrary shaped copper objects not being pads; a.k.a. pcb antenne; but this includes copper text or mask cutout text too; your company logo can really be a footprint - arbitrary mask cutouts, mask cutouts that are not derived from pads - arbitrary placement of paste; want a grid of paste blobbs on the center pad of your largish qfn? no need t emulate it with 10 pads, just draw them on the paste layer - slots or other cutouts/edge-contour-patterns; even the whole board shape can be a footprint - text and polygon on silk Will grouping of parts be available at some stage of the subcircuit rebuild? Schedule ~~~~~~~~ This will probably take a long time, spanning multiple development cyclces, just like the layer rewrite did. Stage 1: We will start implementing it in the current cycle and will make it gradually grow until it reaches its full featured, final form. We will make sure that at every intermediate release subcircuits are usable and alreayd provide extra features over footprints. We will keep the original footprints in place during this process. Lihata board v3 will have support for subcircuits. The subcircuit subtree will also be avaialble as a subcircuit file format for sharing footprints. While we are in this stage, we'll encourage users to use subcricuits instead of footprints, and always save in lihata board v3 instead of other formats. However, the code will still be able to use the old footprints in parallel. Stage 2: At some point in time subcircuits will be capable enough to replace footprints. At this point we will remove footprints, pins, pads, element-lines, element-arcs. We will also need to rewrite import code to convert old elements to subcricuits on load and rewrite export code to convert subcircuits back to elements for old formats. Stage 3: We'll convert pcblib from the old, element based .fp files to lihata subcircuit files. We'll rewrite the parametric footprint scripts to generate lihata subcircuits instead of pcb elements. This will include extending some of the parametrics with features that was not possible with pcb elements because of the limitaiton of the model/format. (This also means our parametric footprints won't be available for pcb mainline without a conversion or without mainline upgraded to lihata formats and the subcircuit model) What you can do to help ~~~~~~~~~~~~~~~~~~~~~~~ Most wanted: testers. We are again going to change a critical part of the system, we need all sort of testing. Testers with even only a few hours a week are very valuable for getting such new features stable. Second most wanted: contributors on non-coding material (e.g. docs, tutorials, test files) Production users: people who use the stable version of pcb-rnd for actual production boards and report bugs. Especially those who are willing to try out new features that are already labelled stable by developers. Programmers: we have a growing number of developers and contributors, but there's always more work than resources, obviously. Anyone is welcome if they have some free time and willing to accept the pcb-rnd ways of doing things. Be part of one of the most dynamic projects of gEDA! Regards, Igor2 Looking forward to this! -rma --001a113d77cc5b01000550b7fd99 Content-Type: text/html; charset="UTF-8" Content-Transfer-Encoding: quoted-printable <div dir=3D"auto"><div><br><div class=3D"gmail_extra"><br><div class=3D"gma= il_quote">On May 29, 2017 11:11 PM, <<a href=3D"mailto:gedau@igor2.repo= .hu">gedau@igor2.repo.hu</a>> wrote:<br type=3D"attribution"><blockquote= class=3D"quote" style=3D"margin:0 0 0 .8ex;border-left:1px #ccc solid;padd= ing-left:1ex">Hi all,<br></blockquote></div></div></div><div dir=3D"auto">&= lt;Snipped></div><div dir=3D"auto"><div class=3D"gmail_extra"><div class= =3D"gmail_quote"><blockquote class=3D"quote" style=3D"margin:0 0 0 .8ex;bor= der-left:1px #ccc solid;padding-left:1ex"><br></blockquote></div></div></di= v><div dir=3D"auto"><div class=3D"gmail_extra"><div class=3D"gmail_quote"><= blockquote class=3D"quote" style=3D"margin:0 0 0 .8ex;border-left:1px #ccc = solid;padding-left:1ex"> Result:<br> <br> In practice this means our new footprints will be capable of hosting:<br> <br> - arbitrary shaped pads drawn as lines and polygons<br> <br> - arbitrary shaped copper objects not being pads; a.k.a. pcb antenne; but t= his includes copper text or mask cutout text too; your company logo can rea= lly be a footprint<br> <br> - arbitrary mask cutouts, mask cutouts that are not derived from pads<br> <br> - arbitrary placement of paste; want a grid of paste blobbs on the center p= ad of your largish qfn? no need t emulate it with 10 pads, just draw them o= n the paste layer<br> <br> - slots or other cutouts/edge-contour-patterns; even the whole board shape = can be a footprint<br> <br> - text and polygon on silk<br></blockquote></div></div></div><div dir=3D"au= to"><br></div><div dir=3D"auto">Will grouping of parts be available at some= stage of the subcircuit rebuild?</div><div dir=3D"auto"><br></div><div dir= =3D"auto"><div class=3D"gmail_extra"><div class=3D"gmail_quote"><blockquote= class=3D"quote" style=3D"margin:0 0 0 .8ex;border-left:1px #ccc solid;padd= ing-left:1ex"> <br> Schedule<br> ~~~~~~~~<br> <br> This will probably take a long time, spanning multiple development cyclces,= just like the layer rewrite did.<br> <br> Stage 1:<br> <br> We will start implementing it in the current cycle and will make it gradual= ly grow until it reaches its full featured, final form. We will make sure t= hat at every intermediate release subcircuits are usable and alreayd provid= e extra features over footprints. We will keep the original footprints in p= lace during this process.<br> <br> Lihata board v3 will have support for subcircuits. The subcircuit subtree w= ill also be avaialble as a subcircuit file format for sharing footprints.<b= r> <br> While we are in this stage, we'll encourage users to use subcricuits in= stead of footprints, and always save in lihata board v3 instead of other fo= rmats. However, the code will still be able to use the old footprints in pa= rallel.<br> <br> Stage 2:<br> <br> At some point in time subcircuits will be capable enough to replace footpri= nts. At this point we will remove footprints, pins, pads, element-lines, el= ement-arcs. We will also need to rewrite import code to convert old element= s to subcricuits on load and rewrite export code to convert subcircuits bac= k to elements for old formats.<br> <br> Stage 3:<br> <br> We'll convert pcblib from the old, element based .fp files to lihata su= bcircuit files. We'll rewrite the parametric footprint scripts to gener= ate lihata subcircuits instead of pcb elements. This will include extending= some of the parametrics with features that was not possible with pcb eleme= nts because of the limitaiton of the model/format.<br> <br> (This also means our parametric footprints won't be available for pcb m= ainline without a conversion or without mainline upgraded to lihata formats= and the subcircuit model)<br> <br> <br> <br> What you can do to help<br> ~~~~~~~~~~~~~~~~~~~~~~~<br> <br> Most wanted: testers. We are again going to change a critical part of the s= ystem, we need all sort of testing. Testers with even only a few hours a we= ek are very valuable for getting such new features stable.<br> <br> Second most wanted: contributors on non-coding material (e.g. docs, tutoria= ls, test files)<br> <br> Production users: people who use the stable version of pcb-rnd for actual p= roduction boards and report bugs. Especially those who are willing to try o= ut new features that are already labelled stable by developers.<br> <br> Programmers: we have a growing number of developers and contributors, but t= here's always more work than resources, obviously. Anyone is welcome if= they have some free time and willing to accept the pcb-rnd ways of doing t= hings. Be part of one of the most dynamic projects of gEDA!<br> <br> Regards,<br> <br> Igor2<br> <br></blockquote><blockquote class=3D"quote" style=3D"margin:0 0 0 .8ex;bor= der-left:1px #ccc solid;padding-left:1ex"><br></blockquote></div></div></di= v><div dir=3D"auto">Looking forward to this!</div><div dir=3D"auto"><br></d= iv><div dir=3D"auto">-rma</div></div> --001a113d77cc5b01000550b7fd99--
Reply subtree:
702 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model redesign) from miloh <fr...@gmail.com>
703 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model from ge...@igor2.repo.hu
704 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model redesign) from miloh <fr...@gmail.com>
705 Re: [pcb-rnd] up next: subcircuits (a.k.a. footprint model from ge...@igor2.repo.hu