ID: | 3113 |
From: | Peter Stuge <pe...@stuge.se> |
Date: | Sat, 1 Jun 2019 19:14:48 +0000 |
Subject: | Re: [pcb-rnd] discussion: place order feature |
in-reply-to: | 3111 from ge...@igor2.repo.hu |
replies: | 3114 from ge...@igor2.repo.hu |
gedau@igor2.repo.hu wrote: > >> At the moment we have full support for bbvias in the data model, in core > >> and in the GUI, but we can not export them, simply because we don't know > >> how exactly it should be done _in practice_. > > > >Here I may be able to contribute something; open hardware manufacturing > >files (gerber) for an open hardware prototype (designed in KiCad, so KiCad > >files are also available) which uses bbvias on a 4-layer board, and was > >fabbed successfully by CONTAG AG outside Berlin. Should I send them over? > > Thanks, but what we need is the other way around: if I sit down to > upgrade our gerber exporter for bbvias, we need to get the result tested. Sure. But the first step is to implement something that can be tested, and for implementation I find known-good data points to be helpful. > The problem is not the implemenation. The problem is how do we get > _our_ implementation tested. An implementation that doesn't exist can't very well be tested. Once an implementation exists then the testers may emerge. :) Considering the required effort I guess noone will commit to testing before something is ready. This feature might also be a good candidate for sponsoring, but there too the gerbers and/or .lht should exist first. //Peter
Reply subtree:
3113 Re: [pcb-rnd] discussion: place order feature from Peter Stuge <pe...@stuge.se>
3114 Peter, very last warning (was: bbvia, Re: [pcb-rnd] discussion: from ge...@igor2.repo.hu