| ID: | 3111 |
| From: | ge...@igor2.repo.hu |
| Date: | Sat, 1 Jun 2019 03:54:10 +0200 (CEST) |
| Subject: | Re: [pcb-rnd] discussion: place order feature |
| in-reply-to: | 3110 from Peter Stuge <pe...@stuge.se> |
| replies: | 3113 from Peter Stuge <pe...@stuge.se> |
On Fri, 31 May 2019, Peter Stuge wrote: >gedau@igor2.repo.hu wrote: >> 4. extra: support us on figuring how to export fancy features >> >> At the moment we have full support for bbvias in the data model, in core >> and in the GUI, but we can not export them, simply because we don't know >> how exactly it should be done _in practice_. > >Here I may be able to contribute something; open hardware manufacturing >files (gerber) for an open hardware prototype (designed in KiCad, so KiCad >files are also available) which uses bbvias on a 4-layer board, and was >fabbed successfully by CONTAG AG outside Berlin. Should I send them over? Thanks, but what we need is the other way around: if I sit down to upgrade our gerber exporter for bbvias, we need to get the result tested. The problem is not that we don't know how to do it in theory (e.g. we don't see how kicad or others do it). The problem is not the implemenation. The problem is how do we get _our_ implementation tested. Regards, Igor2
Reply subtree:
3111 Re: [pcb-rnd] discussion: place order feature from ge...@igor2.repo.hu
3113 Re: [pcb-rnd] discussion: place order feature from Peter Stuge <pe...@stuge.se>
3114 Peter, very last warning (was: bbvia, Re: [pcb-rnd] discussion: from ge...@igor2.repo.hu