ID: | 3110 |
From: | Peter Stuge <pe...@stuge.se> |
Date: | Fri, 31 May 2019 20:38:54 +0000 |
Subject: | Re: [pcb-rnd] discussion: place order feature |
in-reply-to: | 3108 from ge...@igor2.repo.hu |
replies: | 3111 from ge...@igor2.repo.hu |
gedau@igor2.repo.hu wrote: > 4. extra: support us on figuring how to export fancy features > > At the moment we have full support for bbvias in the data model, in core > and in the GUI, but we can not export them, simply because we don't know > how exactly it should be done _in practice_. Here I may be able to contribute something; open hardware manufacturing files (gerber) for an open hardware prototype (designed in KiCad, so KiCad files are also available) which uses bbvias on a 4-layer board, and was fabbed successfully by CONTAG AG outside Berlin. Should I send them over? //Peter
Reply subtree:
3110 Re: [pcb-rnd] discussion: place order feature from Peter Stuge <pe...@stuge.se>
3111 Re: [pcb-rnd] discussion: place order feature from ge...@igor2.repo.hu
3113 Re: [pcb-rnd] discussion: place order feature from Peter Stuge <pe...@stuge.se>
3114 Peter, very last warning (was: bbvia, Re: [pcb-rnd] discussion: from ge...@igor2.repo.hu