| ID: | 136 |
| From: | John Griessen <jo...@cibolo.com> |
| Date: | Sat, 12 Nov 2016 13:54:20 -0600 |
| Subject: | Re: [pcb-rnd] parametric footprints |
| in-reply-to: | 135 from John Griessen <jo...@cibolo.com> |
| replies: | 138 from ge...@igor2.repo.hu |
On 11/12/2016 01:42 PM, John Griessen wrote: > 4. rows of square pads with paste are generated on top of the center pad, with specification for > being sized from 1mm across to 2mm across with a pitch of 2mm. > > Here is some guideline info on qfns: > > http://ecosensory.com/geda/qfn_guidelines.png Beyond making qf.awk ready to use minimally, looking at this shows how attributes-per-object of layout can go farther. If you created a new layer solderpaste that would allow fully following guidelines for qfn. Another way is add attributes per pad about what paste shrink or bloat is and generate past as a post processing layer of rs274-x I like the idea of generating both soldermask and solderpaste from pads, vias with attributes on them. Seems better than having to learn to think of separately editing those layers. I don't seen any lihata name=vlaue pairs in the .pcb file yet. Is that coming soon?
Reply subtree:
136 Re: [pcb-rnd] parametric footprints from John Griessen <jo...@cibolo.com>
138 Re: [pcb-rnd] parametric footprints from ge...@igor2.repo.hu
141 Re: [pcb-rnd] parametric footprints from John Griessen <jo...@cibolo.com>
142 Re: [pcb-rnd] parametric footprints from ge...@igor2.repo.hu